A focused laser beam can be a microscopic cutting tool. The laser micromachining market is growing rapidly, as lasers offer a non-contact, high-precision, and versatile method for micro-manufacturing.

Types of Lasers for Micromachining

The [LSI keyword: laser micromachining market] uses several laser types. Nanosecond (ns) UV lasers (355 nm) are used for drilling microvias in PCBs and for cutting polyimide. The laser micromachining market for ns UV lasers is the largest. Picosecond (ps) lasers (pulse duration 1-1000 ps) reduce heat-affected zone (HAZ) compared to ns lasers. The laser micromachining market for ps lasers is growing. Femtosecond (fs) lasers (pulse duration < 1 ps) have almost no HAZ and can machine any material (including transparent materials like glass and sapphire). The laser micromachining market for fs lasers is the fastest-growing. CO2 lasers (10.6 µm) are used for cutting and engraving of polymers (but not metals). The laser micromachining market for CO2 is mature. The laser micromachining market for "fiber" lasers (which are compact and efficient) is used for marking and for some cutting.

The laser micromachining market for "micro-drilling" is used for cooling holes in turbine blades (aerospace), for fuel injector nozzles (automotive), and for inkjet printer heads. The laser micromachining market for "micro-cutting" is used for stents (medical), for watch gears, and for cutting silicon wafers (semiconductor). The laser micromachining market for "micro-ablation" (removing a thin surface layer) is used for trimming resistors and for surface texturing (to improve adhesion or reduce friction).

Beam Delivery and Manipulation

The laser micromachining market includes the beam delivery system. Galvanometer scanners (galvo scanners) move the beam quickly over the workpiece, used for marking and for laser drilling of arrays. The laser micromachining market for galvo scanners is standard. Precision motion stages (air-bearing or linear motor) move the workpiece under a stationary beam. The laser micromachining market for "X-Y" stages is used for cutting large parts (e.g., stents). The laser micromachining market for "rotary" stages is used for drilling holes around a cylinder. The laser micromachining market for "beam shaping" (using diffractive optical elements – DOEs) allows multiple spots or a specific intensity profile. As the laser micromachining market continues to evolve, the focus will be on "higher" pulse energy (to cut thicker materials), on "shorter" pulse duration (to reduce HAZ), and on "beam combining" (multiple lasers to increase throughput). The laser micromachining market is enabling new applications that were previously impossible with mechanical tools.

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